TECHNICAL LIBRARY

Articles and white papers for optical-system decisions

Independent, vendor-neutral explanations that connect photonic devices with architecture, packaging, manufacturing, test, reliability, and system economics.

FEATURED RESOURCE

WHITE PAPER · PACKAGING

Why Optical I/O Coupling Fails at the Package Level

A practical framework for choosing an interface that survives assembly shift, package movement, full-array variation, measurement, and yield constraints.

Read the white paper →
CPO architectureOptical I/OFiber couplingActive componentsLink engineering
01

FIBER COUPLING

Fiber Coupling Is Not Just an Efficiency Problem

Why tolerance, packaging, manufacturing, reliability, and test determine whether an interface scales.

Read the guide →
02

ACTIVE COMPONENTS

Why Optical Modulators Matter—and Where They Hurt

How bandwidth, loss, drive, thermal control, packaging, and yield shape the transmitter.

Read the guide →
03

FOUNDATIONS

CPO, Optical I/O, and Silicon Photonics Are Not the Same Thing

Understand the architecture, data-movement function, and technology platform as separate decisions.

Read the guide →
04

ARCHITECTURE

What Actually Changes When Moving from Pluggables to CPO?

A systems view of electrical reach, thermal constraints, serviceability, and business tradeoffs.

Read the guide →
05

LINK ENGINEERING

How to Read an Optical Link Specification

A practical checklist for wavelengths, channels, BER, FEC, temperature, power, and margin.

Read the guide →